WATERLOO - Terepac Corp., a pioneer in the world's tiniest digital electronics, and Rockwell Automation have engaged so Terepac can produce large volumes of its micro circuits for the "Internet of Things" -- uniquely identifiable objects and their virtual representations in an Internet-like structure that requires radio frequency identification (RFID) as a prerequisite.
Based on the agreement, Rockwell Automation will support the infrastructure that Terepac uses for its proprietary process, enabling it to miniaturize significantly more circuits than its current capability.
"Advanced manufacturing technology is rapidly transforming the global competitive landscape, and Terepac is using its unique technology to produce very small circuits," said Sujeet Chand, senior vice president and chief technology officer, Rockwell Automation. "We have a unique opportunity to help Terepac scale its breakthrough technology and advance microelectronics to the next level."
"We're pleased to work with Rockwell Automation's highly qualified team because they're a world leader in the delivery of industrial automation solutions," said Terepac CEO Ric Asselstine. "They share our goal to create extraordinary technology to give people everywhere more useful information about the world around them."
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